Precision component cut by wire EDM for semiconductor equipment. Wire EDM holds very tight geometry with minimal burrs and no cutting force, producing the clean, low-residue edges that semiconductor tooling requires. Dark surface finish suits light-sensitive and optical-adjacent assemblies.
Key Features
- Clean, low-residue EDM edges (typical of wire EDM)
- Tight, force-free geometry from wire EDM
- Dark finish suits light-sensitive assemblies
Typical capability for the Semiconductor industry — actual values are machined to your drawing.
